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Acrylic acid instant bond adhesive VNOVO 100

An adhesive

Acrylic acid instant bond adhesive VNOVO 100

    VNOVO ® 100 is a low viscosity, surface insensitive instant adhesive with high toughness and low blushing properties. It has the ability to quickly bond to many substrates, including metals, plastics and rubbers. It is also used to bond acidic or porous materials.

    Application

    Suitable for materials such as silicone, metal, plastic and rubber.

    Product Data

    Properties

    Value

    Chemical type

    Ethyl cyanoacrylate

    Appearance

    Colorless transparent liquid

    Specific gravity

    1.1

    Viscosity (LICHEN, 3#, 6rpm), mPa.s

    80-120

    Boiling point ℃

    54-56 (2.6-3 mmHg)

    Flash point ℃

    >75

    Curing time, s

    >5

    Typical Curing Characteristics

    Under normal conditions, moisture on the surface of the bonding material will initiate the curing reaction of this product. This product will reach full application strength in a relatively short period of time, but will require a minimum of 24 hours of curing to develop full chemical/solvent resistance.

    Relationship between curing speed and substrate

    The curing speed depends on the substrate being bonded. The following table shows the fixing time for bonding different substrates at 23℃/50% relative humidity. The fixing time is defined as the time when the shear strength of the sample reaches 0.1N/nm.

    Substrate

    Fixed time, S

    Steel (degreased)

    5-20

    Aluminium

    10-20

    Neoprene

    ﹤5

    Nitrile

    ﹤5

    ABS

    ﹤5

    PVC

    5-30

    Polycarbonate

    10-25

    Phenolic

    ﹤5

    Wood (balsa)

    ﹤5

    Wood (oak)

    15-30

    Wood (pine)

    15-20

    Cardboard

    ﹤5

    Cloth

    10-20

    Leather

    15-30

    Paper

    5-10

    Relationship between curing speed and bonding gap
    The curing rate depends on the bonding gap. A small bonding gap will result in a fast curing speed, while a larger bonding gap will reduce the curing speed.
    Relationship between curing speed and accelerator
    When the bonding gap is too large, resulting in slow curing, using an accelerator on the substrate surface can increase the curing speed. However, this treatment will reduce the final strength of the bond. Therefore, it is recommended to conduct a test to determine the actual bonding effect.
    Typical properties of bonding substrates, GB/T 7124-2008
    Bond properties
    Cure 10 seconds @ 23℃
    Tensile shear strength:  MPa ≥ 6.8
    Cure 72 hours @ 23℃
    Tensile shear strength:  MPa 23

    Substrate

    Tensile shear strength, MPa

    Steel (sandblasted)

    21.5

    Aluminum (etched)

    13.2

    Zinc dichromate

    2.8

    ABS *

    7.6 

    PVC *

    9.8 

    Phenolic resin *

    12.8 

    Polycarbonate *

    9.7 

    Nitrile rubber *

    1.4 

    Neoprene rubber *

    1.1 

    *Indicates material damage

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