Thermal Paste

With the application of more modern, higher power components and the trend towards miniaturization of products,many electronic devices generate a large amount of heat during use.
When the components of the electronic equipment are steadily raised and the equilibrium temperature is reached,the rate of heat dissipation will equal the rate of heat generation.This temperature is enough to significantly shorten the service life of components and even lead to damage of components.
At the same time, the performance of electronic equipment will be seriously reduced or even stop working under continuous heating and high temperature.
At this point, the use of thermal interface materials is necessary.Because the surface of the heat source and radiator will have a certain roughness even if it is finely polished.When two material surfaces are placed together, they do not touch 100% and there is usually an air gap between them.
The thermal interface material can fill these gaps to ensure that the two surfaces are fully in contact.Thus more effective heat dissipation and improving product performance and reliability.

VNOVO Thermal Greases is a special silicone oil as the base oil, compounded with heat conductive metal oxides.

This combination promotes high thermal conductivity, low bleed and high temperature stability.The compounds are designed to maintain a positive heat sink seal.It helps improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.Long-term, reliable protection of sensitive circuits and components is important in many of today’s delicate and demanding electronic applications.

With the increase in processing power and the trend toward smaller, more compact electronic modules,these factors typically mean that more heat is generated in the device.

As such, Thermal Greases play an integral role here.Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).Thermal Greases have properties such as low thermal resistance, high thermal conductivity.

It can achieve thin bonding line thickness (blt), which helps improve heat transfer from the device.Compared to other thermal interface materials (TIMs),Thermal Greases have the advantages of relatively low cost, ease of application in radiators (screen printing), and ease of rework.

Typical Application Scenarios

• Engine and transmission
• control modules
• Cpu/Mobile, desktop, server CPUs
• Memory modules
• Power supplies and UPS
• Power conversion equipment
• IGBT
• Lighting Equipment
• Power semiconductors

Evaluation and Measurement of Thermal Performance

Two values that represent the thermal properties of thermal interface materials are thermal conductivity (λ) and thermal resistance (R).
Heat-dissipation performance is directly proportional to thermal conductivity and inversely proportional to thermal resistance.
Heat-dissipation is also largely dependent on the thermal contact resistance of the interface between the heat-generating component and the heat-radiating component.
It is not affected only by the thermal conductivity of the thermal interface silicone between them.

Thermal Conductivity λ

• Q=λ×(T₁-T₂)×A/L
• λ=(Q/A) × L/(T₁-T₂)

Therefore:

• Q:quantity of transmitted heat
• A: cross section area
• L:heat transfer distance
• T₁:temperature of high-temperature side
• T₂:temperature of low-temperature side

Thermal Resistance R

• R₀=(T₁-T₂)/Q = L/(λ×A)
• R=R₀+Rₛ

In Practice:

• R₀:inherent thermal resistance of the substance
• Rₛ:thermal contact resistance